United States
Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies
Refer to the Attachment, R2.0_SS_RFI_SUBMISSION_v1.2.
- Buyer
- DEPT OF DEFENSE - DEPT OF THE ARMY
- Country
- United States
- Location
- USA
- Deadline
- September 17, 2026
- Published
- August 17, 2026
- Procedure
- Special Notice
- Source
- SAM.gov
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CPV NAICS:541715, PSC:R425